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| (R) ISL3259E Data Sheet February 18, 2008 FN6587.1 15kV ESD Protected, 100Mbps, 5V, PROFIBUS(R), Full Fail-safe, RS-485/RS-422 Transceivers Intersil's ISL3259E is a 15kV IEC61000 ESD Protected, 5V powered, single transceiver that meets both the RS-485 and RS-422 standards for balanced communication. It also features the larger output voltage and higher data rate (up to 100Mbps) required by high speed PROFIBUS applications. The low bus currents (+220A/-150A) present a "1/5 unit load" to the RS-485 bus, thus allowing up to 160 transceivers on the network without violating the RS-485 specification's load limit, and without using repeaters. This transceiver requires a 5V supply, and delivers at least a 2.1V differential output voltage. This translates into better noise immunity (data integrity), longer reach, or the ability to drive up to six 120 terminations in "star" or other non-standard bus topologies. SCSI applications benefit from the ISL3259's low receiver and transmitter part-to-part skews, which make it perfect for high speed parallel applications where large numbers of bits must be simultaneously captured. The low bit-to-bit skew eases the timing constraints on the data latching signal. Receiver (Rx) inputs feature a "Full Fail-Safe" design, which ensures a logic high Rx output if Rx inputs are floating, shorted, or terminated but undriven. Rx outputs feature high drive levels (typically >30mA @ VOL = 1V) to ease the design of optically isolated interfaces. Hot Plug circuitry ensures that the Tx and Rx outputs remain in a high impedance state while the power supply stabilizes. Driver (Tx) outputs are short circuit protected, even for voltages exceeding the power supply voltage. Additionally, on-chip thermal shutdown circuitry disables the Tx outputs to prevent damage if power dissipation becomes excessive. Features * IEC61000 ESD Protection on RS-485 I/O Pins . . . 15kV - Class 3 HBM ESD Level on all Other Pins . . . . . . >9kV * Large Differential VOUT . . . . . . . . . . . . . . . 2.8V into 54 Better Noise Immunity, or Drive up to 6 Terminations * Very High Data Rate . . . . . . . . . . . . . . . . up to 100Mbps * 11/13ns (Max) Tx/Rx Propagation Delays; 1.5ns (Max) Skew * 1/5 Unit Load Allows up to 160 Devices on the Bus * Full Fail-Safe (Open, Shorted, Terminated/Undriven) Receiver * High Rx IOL to Drive Opto-Couplers for Isolated Applications * Hot Plug - Tx and Rx Outputs Remain Three-State During Power-Up * Low Quiescent Supply Current . . . . . . . . . . . . . . . . . 4mA * Low Current Shutdown Mode. . . . . . . . . . . . . . . . . . . 1A * -7V to +12V Common Mode Input Voltage Range * Three-State Rx and Tx Outputs * Operates from a Single +5V Supply * Current Limiting and Thermal Shutdown for Driver Overload Protection * Pb-Free (RoHS Compliant) Applications * PROFIBUS(R) DP and FMS Networks * SCSI "Fast 40" Drivers and Receivers * Motor Controller/Position Encoder Systems * Factory Automation * Field Bus Networks * Security Networks * Building Environmental Control Systems * Industrial/Process Control Networks 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2007, 2008. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL3259E Ordering Information PART NUMBER (Notes 1, 2) ISL3259EIBZ ISL3259EIUZ ISL3259EIRZ NOTES: 1. Add "-T" suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. PART MARKING 3259 EIBZ 3259Z 3259 TEMP. RANGE (C) -40 to +85 -40 to +85 -40 to +85 PACKAGE (Pb-Free) 8 Ld SOIC 8 Ld MSOP 10 Ld 3x3 DFN PKG. DWG. # M8.15 M8.118 L10.3x3C Pinouts ISL3259E (8 LD MSOP, SOIC) TOP VIEW RO 1 RE 2 DE 3 DI 4 D 8 7 6 5 VCC B/Z A/Y GND ISL3259E (10 LD DFN) TOP VIEW R RO RE DE DI NC 1 2 3 4 5 10 VCC 9 NC 8 B/Z 7 A/Y 6 GND Truth Table TRANSMITTING INPUTS RE X X 0 1 DE 1 1 0 0 DI 1 0 X X OUTPUTS B/Z 0 1 High-Z High-Z* A/Y 1 0 High-Z High-Z* Truth Table RECEIVING INPUTS RE 0 0 0 1 1 DE 0 0 0 1 0 A-B -0.05V -0.2V Inputs Open/Shorted X X OUTPUT RO 1 0 1 High-Z High-Z* NOTE: *Shutdown Mode NOTE: *Shutdown Mode 2 FN6587.1 February 18, 2008 ISL3259E Pin Descriptions PIN RO FUNCTION Receiver output: If A - B -50mV, RO is high; If A - B -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted, or connected to a terminated bus that is undriven. Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. If the Rx enable function isn't required, connect RE directly to GND. Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. If the Tx enable function isn't required, connect DE to VCC through a 1k or greater resistor. Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. Ground connection. This is also the potential of the DFN thermal pad. 15kV IEC61000 ESD Protected RS-485, RS-422 level, noninverting receiver input and noninverting driver output. Pin is an input (A) if DE = 0; pin is an output (Y) if DE = 1. 15kV IEC61000 ESD Protected RS-485, RS-422 level, inverting receiver input and inverting driver output. Pin is an input (B) if DE = 0; pin is an output (Z) if DE = 1. System power supply input (4.75V to 5.25V). No Connection. RE DE DI GND A/Y B/Z VCC NC Typical Operating Circuit ISL3259E +5V + 8 VCC 1 RO 2 RE 3 DE 4 DI R B/Z A/Y 7 6 RT RT 7 6 B/Z A/Y 0.1F MSOP PIN NUMBERS SHOWN 0.1F + 8 VCC D DI 4 DE 3 RE 2 R GND 5 GND 5 RO 1 +5V D 3 FN6587.1 February 18, 2008 ISL3259E Absolute Maximum Ratings VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input/Output Voltages A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table Thermal Information Thermal Resistance (Typical) JA (C/W) 8 Ld SOIC Package (Note 3) . . . . . . . . . . . . . . . . . . 105 8 Ld MSOP Package (Note 3) . . . . . . . . . . . . . . . . . 140 10 Ld DFN Package (Note 4). . . . . . . . . . . . . . . . . . 75 Maximum Junction Temperature (Plastic Package) . . . . . . +150C Maximum Storage Temperature Range . . . . . . . . . .-65C to +150C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40C to +85C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTE: 3. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 4. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. See Tech Brief TB379. Electrical Specifications Test Conditions: VCC = 4.75V to 5.25V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25C, (Note 5). SYMBOL TEST CONDITIONS TEMP (C) MIN (Note 14) TYP MAX (Note 14) UNITS PARAMETER DC CHARACTERISTICS Driver Differential VOUT VOD No Load RL = 100 (RS-422) (Figure 1A) RL = 54 (RS-485) (Figure 1A) RL = 60, -7V VCM 12V (Figure 1B) Full Full Full Full Full 2.6 2.1 1.9 - 3.4 2.8 2.7 0.01 VCC VCC 0.2 V V V V Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States Logic Input High Voltage Logic Input Low Voltage Logic Input Current Input Current (A/Y, B/Z) VOD RL = 54 or 100 (Figure 1A) VOC VOC RL = 54 or 100 (Figure 1A) RL = 54 or 100 (Figure 1A) Full Full - 2 0.01 3 0.2 V V VIH VIL IIN1 IIN2 DI, DE, RE DI, DE, RE DI = DE = RE = 0V or VCC DE = 0V, VCC = 0V or 5.25V VIN = 12V VIN = -7V Full Full Full Full Full Full 25 Full 25 Full Full Full Full 2 -2 -160 -200 VCC - 0.5 25 -1 9 28 40 0.015 0.8 2 220 250 -50 0.4 1 V V A A A mA pF mV mV V V mA A Driver Short-Circuit Current, VO = High or Low Differential Capacitance Receiver Differential Threshold Voltage Receiver Input Hysteresis Receiver Output High Voltage Receiver Output Low Voltage Receiver Output Low Current Three-State (High Impedance) Receiver Output Current IOSD1 CD VTH VTH VOH VOL IOL IOZR DE = VCC, -7V VY or VZ 12V (Note 7) A/Y to B/Z -7V VCM 12V VCM = 0V IO = -8mA, VID = -50mV IO = +10mA, VID = -200mV VOL = 1V, VID = -200mV 0.4V VO 2.4V 4 FN6587.1 February 18, 2008 ISL3259E Electrical Specifications Test Conditions: VCC = 4.75V to 5.25V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25C, (Note 5). (Continued) SYMBOL RIN IOSR TEST CONDITIONS -7V VCM 12V 0V VO VCC TEMP (C) Full Full MIN (Note 14) 54 20 TYP 80 MAX (Note 14) 110 UNITS k mA PARAMETER Receiver Input Resistance Receiver Short-Circuit Current SUPPLY CURRENT No-Load Supply Current (Note 6) Shutdown Supply Current ESD PERFORMANCE RS-485 Pins (A/Y, B/Z) ICC ISHDN DI = DE = 0V or VCC DE = 0V, RE = VCC, DI = 0V or VCC Full Full - 2.6 0.05 4 1 mA A IEC61000-4-2, Air-Gap Discharge Method IEC61000-4-2, Contact Discharge Method Human Body Model, From Bus Pins to GND 25 25 25 25 25 - 15 8 16.5 > 9 > 400 - kV kV kV kV V All Pins HBM, per MIL-STD-883 Method 3015 Machine Model DRIVER SWITCHING CHARACTERISTICS Maximum Data Rate Driver Differential Output Delay Driver Differential Output Skew Prop Delay Part-to-Part Skew Driver Differential Rise or Fall Time Driver Enable to Output High Driver Enable to Output Low Driver Enable Time Skew Driver Disable from Output High Driver Disable from Output Low Driver Disable Time Skew Time to Shutdown Driver Enable from Shutdown to Output High Driver Enable from Shutdown to Output Low fMAX tDD tSKEW tSKP-P tR, tF tZH tZL VOD 1.5V, RD = 54, CL = 100pF (Figure 4) RD = 54, CD = 50pF (Figure 2) RD = 54, CD = 50pF (Figure 2) RD = 54, CD = 50pF (Figure 2), (Note 13) RD = 54, CD = 50pF (Figure 2) RL = 110, CL = 50pF, SW = GND (Figure 3), (Note 8) RL = 110, CL = 50pF, SW = VCC (Figure 3), (Note 8) Full Full Full Full Full Full Full Full Full Full Full Full Full Full 100 2 60 8 0.5 5 13 11 2.5 14 12 3 12 1.5 4 8 20 20 20 20 600 1000 1000 Mbps ns ns ns ns ns ns ns ns ns ns ns ns ns tENSKEW |tZH (Y or Z) - tZL (Z or Y)| tHZ tLZ RL = 110, CL = 50pF, SW = GND (Figure 3) RL = 110, CL = 50pF, SW = VCC (Figure 3) tDISSKEW |tHZ (Y or Z) - tLZ (Z or Y)| tSHDN (Note 10) tZH(SHDN) RL = 110, CL = 50pF, SW = GND (Figure 3), (Notes 10, 11) tZL(SHDN) RL = 110, CL = 50pF, SW = VCC (Figure 3), (Notes 10, 11) RECEIVER SWITCHING CHARACTERISTICS Maximum Data Rate Receiver Input to Output Delay Receiver Skew | tPLH - tPHL | Prop Delay Part-to-Part Skew Receiver Enable to Output High Receiver Enable to Output Low Receiver Disable from Output High fMAX VID = 1.5V Full Full Full Full Full Full Full 100 9 0 13 1.5 4 12 12 12 Mbps ns ns ns ns ns ns tPLH, tPHL (Figure 5) tSKD tSKP-P tZH tZL tHZ (Figure 5) (Figure 5), (Note 13) RL = 1k, CL = 15pF, SW = GND (Figure 6), (Note 9) RL = 1k, CL = 15pF, SW = VCC (Figure 6), (Note 9) RL = 1k, CL = 15pF, SW = GND (Figure 6) 5 FN6587.1 February 18, 2008 ISL3259E Electrical Specifications Test Conditions: VCC = 4.75V to 5.25V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25C, (Note 5). (Continued) SYMBOL tLZ tSHDN TEST CONDITIONS RL = 1k, CL = 15pF, SW = VCC (Figure 6) (Note 10) TEMP (C) Full Full Full Full MIN (Note 14) 60 TYP MAX (Note 14) 12 600 1000 1000 UNITS ns ns ns ns PARAMETER Receiver Disable from Output Low Time to Shutdown Receiver Enable from Shutdown to Output High Receiver Enable from Shutdown to Output Low NOTES: tZH(SHDN) RL = 1k, CL = 15pF, SW = GND (Figure 6), (Notes 10, 12) tZL(SHDN) RL = 1k, CL = 15pF, SW = VCC (Figure 6), (Notes 10, 12) 5. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 6. Supply current specification is valid for loaded drivers when DE = 0V. 7. Applies to peak current. See "Typical Performance Curves" starting on page 11 for more information. 8. Because of the shutdown feature, keep RE = 0 to prevent the device from entering SHDN. 9. Because of the shutdown feature, the RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN. 10. These IC's are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 60ns, the parts are guaranteed not to enter shutdown. If the inputs are in this state for at least 700ns, the parts are guaranteed to have entered shutdown. See "Low Power Shutdown Mode" on page 11. 11. Keep RE = VCC, and set the DE signal low time >700ns to ensure that the device enters SHDN. 12. Set the RE signal high time >700ns to ensure that the device enters SHDN. 13. This is the part-to-part skew between any two units tested with identical test conditions (Temperature, VCC, etc.). 14. Parts are 100% tested at +25C. Over-temperature limits established by characterization and are not production tested. Test Circuits and Waveforms VCC DE DI D Y Z VOD RL/2 VCC 375 DE DI D Y Z VOD RL = 60 VCM -7V TO +12V 375 RL/2 VOC FIGURE 1A. VOD AND VOC FIGURE 1B. VOD WITH COMMON MODE LOAD FIGURE 1. DC DRIVER TEST CIRCUITS 6 FN6587.1 February 18, 2008 ISL3259E Test Circuits and Waveforms (Continued) 3V DI 1.5V 1.5V 0V VCC DE DI D Y Z RD CD OUT (Y) OUT (Z) tPLH tPHL VOH VOL SIGNAL GENERATOR DIFF OUT (Y - Z) tR 90% 10% 90% 10% tF +VOD -VOD SKEW = |tPLH - tPHL| FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE DI D SIGNAL GENERATOR Y 50pF DE (NOTE 10) tZH, tZH(SHDN) 1.5V 1.5V 0V tHZ OUTPUT HIGH VOH - 0.5V OUT (Y, Z) 50% 0V VOH SW Z 110 VCC GND 3V PARAMETER tHZ tLZ tZH tZL tHZ(SHDN) tLZ(SHDN) OUTPUT Y/Z Y/Z Y/Z Y/Z Y/Z Y/Z RE X X 0 (Note 8) 0 (Note 8) 1 (Note 11) 1 (Note 11) DI 1/0 0/1 1/0 0/1 1/0 0/1 SW GND VCC GND VCC GND (NOTE 10) tZL, tZL(SHDN) (NOTE 10) OUT (Y, Z) 50% tLZ VCC VOL + 0.5V V OL OUTPUT LOW VCC FIGURE 3B. MEASUREMENT POINTS FIGURE 3A. TEST CIRCUIT FIGURE 3. DRIVER ENABLE AND DISABLE TIMES VCC DE + DI D Z 54 Y VOD - CL 3V DI 0V SIGNAL GENERATOR CL DIFF OUT (Y - Z) -VOD +VOD 0V FIGURE 4A. TEST CIRCUIT FIGURE 4. DRIVER DATA RATE FIGURE 4B. MEASUREMENT POINTS 7 FN6587.1 February 18, 2008 ISL3259E Test Circuits and Waveforms (Continued) RE +1.5V B A R 15pF RO tPLH SIGNAL GENERATOR 1.7V tPHL VCC RO 1.7V 0V A 1.5V 1.5V 0V +3V FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS FIGURE 5. RECEIVER PROPAGATION DELAY RE GND SIGNAL GENERATOR B A R RO 1k SW 15pF RE VCC GND (NOTE 10) 3V 1.5V 1.5V 0V PARAMETER tHZ tLZ tZH (Note 9) tZL (Note 9) tHZ(SHDN) (Note 12) tLZ(SHDN) (Note 12) DE 0 0 0 0 0 0 A +1.5V -1.5V +1.5V -1.5V +1.5V -1.5V SW GND VCC GND VCC GND VCC tZH, tZH(SHDN) (NOTE 10) RO OUTPUT HIGH tHZ VOH - 0.5V 1.5V 0V VOH tZL, tZL(SHDN) (NOTE 10) RO 1.5V tLZ VCC VOL + 0.5V V OL OUTPUT LOW FIGURE 6A. TEST CIRCUIT FIGURE 6B. MEASUREMENT POINTS FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES 8 FN6587.1 February 18, 2008 ISL3259E Application Information RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any mix of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 spec requires that drivers must handle bus contention without sustaining any damage. Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for runs as long as 4000' (~1200m), so the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. Outputs of the drivers are not slew rate limited, so faster output transition times allow data rates up to100Mbps. Driver outputs are tri-statable via the active high DE input. For parallel applications, bit-to-bit skews between any two ISL3259E transmitter and receiver pairs are guaranteed to be no worse than 8ns (4ns max for any two Tx, 4ns max for any two Rx). High VOD Improves Noise Immunity and Flexibility The ISL3259E driver design delivers larger differential output voltages (VOD) than the RS-485 standard requires, or than most RS-485 transmitters can deliver. The minimum 2.1V VOD guarantees at least 600mV more noise immunity than networks built using standard 1.5V VOD transmitters. Another advantage of the large VOD is the ability to drive more than two bus terminations, which allows for utilizing the ISL3259E in "star" and other multi-terminated, "non-standard" network topologies. Figure 8, details the transmitter's VOD vs IOUT characteristic, and includes load lines for four (30) and six (20) 120 terminations. The figure shows that the driver typically delivers 1.9/1.5V into 4/6 terminations, even at +85C. The RS-485 standard requires a minimum 1.5V VOD into two terminations, but the ISL3259E typically delivers RS-485 voltage levels with 2x to 3x the number of terminations. Receiver (Rx) Features This transceiver utilizes a differential input receiver for maximum noise immunity and common mode rejection. Input sensitivity is 200mV, as required by the RS-422 and RS-485 specifications. Receiver inputs function with common mode voltages as great as 7V outside the power supplies (i.e., +12V and -7V), making them ideal for long networks, or industrial environments, where induced voltages are a realistic concern. The receiver input resistance of 50k surpasses the RS-422 spec of 4k, and is 5x the RS-485 "Unit Load" (UL) requirement of 12k minimum. Thus, the ISL3259E is known as a "one-fifth UL" transceiver, and there can be up to 160 devices on the RS-485 bus while still complying with the RS-485 loading specification. The receiver is a "full fail-safe" version that guarantees a high level receiver output if the receiver inputs are unconnected (floating), shorted together, or connected to a terminated bus with all the transmitters disabled (terminated/undriven). Rx outputs deliver large low state currents (typically >30mA) at VOL = 1V, to ease the design of optically coupled isolated networks. Receivers easily meet the 100Mbps data rate supported by the driver, and the receiver output is tri-statable via the active low RE input. ESD Protection All pins on the ISL3259E include class 3 (>9kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of 16.5kV HBM and 15kV IEC61000-4-2. The RS-485 pins are particularly vulnerable to ESD strikes because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the RS-485 common mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. IEC61000-4-2 Testing The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-485 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The IEC61000 standard's lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device's RS-485 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-485 port. FN6587.1 February 18, 2008 Driver (Tx) Features The RS-485/RS-422 driver is a differential output device that delivers at least 2.1V across a 54 load (RS-485/ PROFIBUS), and at least 2.6V across a 100 load (RS-422) even with VCC = 4.75V. The drivers feature low propagation delay skew to maximize bit width, and to minimize EMI. 9 ISL3259E AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is more difficult to obtain repeatable results. The ISL3259E RS-485 pins withstand 15kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than 9kV. The RS-485 pins of the ISL3259E survive 8kV contact discharges. According to guidelines in the RS-422 and PROFIBUS specifications, networks operating at data rates in excess of 3Mbps should be limited to cable lengths of 100m (328 ft) or less, and the PROFIBUS specification recommends that the more expensive "Type A" (22AWG) cable be used. The ISL3259E's large differential output swing, fast transition times, and high drive-current output stages allow operation even at 100Mbps over standard "CAT-5" cables up to 31m (100 ft). Figures 16 and 17 detail the ISL3259E performance at this condition, with a 120 termination resistor at both the driver and the receiver ends. Note that the differential signal delivered to the receiver at the end of the cable (A - B) still exceeds 1V, so even longer cables could be driven if lower noise margins are acceptable. Of course, jitter or some other criteria may limit the network to shorter cable lengths than those discussed here. If more noise margin is desired, shorter cables may produce a larger receiver input signal. Performance should be even better if the "Type A" cable is utilized. The ISL3259E may also be used at slower data rates over longer cables, but there are some limitations. The Rx is optimized for high speed operation, so its output may glitch if the Rx input differential transition times are too slow. Keeping the transition times below 500ns, (which equates to the Tx driving a 1000' (305m) CAT-5 cable) yields excellent performance over the full operating temperature range. To minimize reflections, proper termination is imperative when using this high data rate transceiver. In point-to-point, or pointto-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120 for "CAT-5", and 220 for "Type A") at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. Hot Plug Function When a piece of equipment powers up, there is a period of time where the processor or ASIC driving the RS-485 control lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. To avoid this scenario, the ISL3259E incorporates a "Hot Plug" function. Circuitry monitoring VCC ensures that, during power-up and power-down, the Tx and Rx outputs remain disabled, regardless of the state of DE and RE, if VCC is less than ~3.2V. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. DE, DI = VCC 3.3V VCC DRIVER Y OUTPUT (V) 0 5.0 RL = 1k 2.5 0 5.0 RL = 1k RO ISL3259E 0 2.5 RECEIVER OUTPUT (V) A/Y ISL3259E 3.1V 2.5 VCC (V) RE = GND 5.0 Built-In Driver Overload Protection As stated previously, the RS-485 specification requires that drivers survive worst case bus contentions undamaged. These transmitters meet this requirement via driver output short circuit current limits, and on-chip thermal shutdown circuitry. The driver output stages incorporate short circuit current limiting circuitry, which ensures that the output current never exceeds the RS-485 specification, even at the common mode voltage range extremes. In the event of a major short circuit condition, the device also includes a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically reenable after the die temperature drops about +15. If the contention persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown. TIME (40s/DIV) FIGURE 7. HOT PLUG PERFORMANCE (ISL3259E) vs ISL83088E WITHOUT HOT PLUG CIRCUITRY Data Rate, Cables, and Terminations Twisted pair is the cable of choice for RS-485, RS-422, and PROFIBUS networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. 10 FN6587.1 February 18, 2008 ISL3259E Low Power Shutdown Mode This BiCMOS transceiver uses a fraction of the power required by their bipolar counterparts, but it also includes a shutdown feature that reduces the already low quiescent ICC to a 50nA trickle. It enters shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 600ns. Disabling both the driver and the receiver for less than 60ns guarantees that the transceiver will not enter shutdown. Note that receiver and driver enable times increase when the transceiver enables from shutdown. Refer to Notes 8, 9, 10, 11 and 12, at the end of the "Electrical Specifications" table on page 6, for more information. Typical Performance Curves 110 +25C 100 DRIVER OUTPUT CURRENT (mA) 90 80 70 60 50 40 30 20 10 0 0 0.5 +85C RD = 30 RD = 20 VCC = 5V, TA = +25C; Unless Otherwise Specified 3.5 DIFFERENTIAL OUTPUT VOLTAGE (V) 3.4 3.3 3.2 3.1 3.0 2.9 2.8 2.7 2.6 2.5 -40 -15 10 35 60 85 RD = 54 RD = 100 RD = 54 RD = 100 1.0 1.5 2.0 2.5 3.0 3.5 4.0 DIFFERENTIAL OUTPUT VOLTAGE (V) 4.5 5.0 TEMPERATURE (C) FIGURE 8. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE FIGURE 9. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 200 150 Y OR Z = LOW OUTPUT CURRENT (mA) 100 50 0 -50 Y OR Z = HIGH -100 ICC (mA) 2.55 2.50 2.45 2.40 2.35 DE = VCC, RE = X OR DE = GND, RE = GND -150 -7 -6 -4 -2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 12 2.30 -40 -15 10 35 60 85 TEMPERATURE (C) FIGURE 10. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE FIGURE 11. SUPPLY CURRENT vs TEMPERATURE 11 FN6587.1 February 18, 2008 ISL3259E Typical Performance Curves 9.0 8.8 PROPAGATION DELAY (ns) 8.6 8.4 8.2 8.0 7.8 7.6 7.4 7.2 7.0 -40 -15 10 35 60 85 0.3 -40 -15 10 35 TEMPERATURE (C) 60 85 tPLH 0.4 tPHL SKEW (ns) 0.8 VCC = 5V, TA = +25C; Unless Otherwise Specified (Continued) 0.9 |tPLH - tPHL| 0.7 0.6 0.5 TEMPERATURE (C) FIGURE 12. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE DRIVER INPUT (V) FIGURE 13. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE RECEIVER OUTPUT (V) RECEIVER OUTPUT (V) RDIFF = 54, CD = 50pF DI 5 0 5 RO 0 RDIFF = 54, CD = 50pF DI 5 0 5 RO 0 DRIVER OUTPUT (V) DRIVER OUTPUT (V) 3 2 1 0 -1 -2 -3 TIME (5ns/DIV) Y-Z 3 2 1 0 -1 -2 -3 TIME (5ns/DIV) Y-Z FIGURE 14. DRIVER AND RECEIVER WAVEFORMS FIGURE 15. DRIVER AND RECEIVER WAVEFORMS DRIVER INPUT (V) RECEIVER OUTPUT (V) 5 0 RECEIVER OUTPUT (V) DI = 100Mbps VCC = 4.75V T = +85C DI = 100Mbps VCC = 4.75V T = +85C 5 0 5.0 RO 0 5.0 RO 0 DRIVER + CABLE DELAY RECEIVER INPUT (V) 3.0 1.5 A-B 0 -1.5 -3.0 (~150ns) RECEIVER INPUT (V) 3.0 1.5 0 A-B -1.5 -3.0 DRIVER + CABLE DELAY (~150ns) TIME (20ns/DIV) TIME (20ns/DIV) FIGURE 16. WORST CASE (NEGATIVE) SINGLE PULSE DRIVER AND RECEIVER WAVEFORMS DRIVING 100 FEET (31 METERS) OF CAT5 CABLE (DOUBLE TERMINATED WITH 120) FIGURE 17. DRIVER AND RECEIVER SEVEN PULSE WAVEFORMS DRIVING 100 FEET (31 METERS) OF CAT5 CABLE (DOUBLE TERMINATED WITH 120) 12 FN6587.1 February 18, 2008 DRIVER INPUT (V) DRIVER INPUT (V) ISL3259E Typical Performance Curves 70 RECEIVER OUTPUT CURRENT (mA) 60 50 40 VOH, +85C 30 20 10 0 0 1 2 3 4 5 RECEIVER OUTPUT VOLTAGE (V) VOL, +25C VOH, +25C VOL, +85C VCC = 5V, TA = +25C; Unless Otherwise Specified (Continued) Die Characteristics SUBSTRATE AND DFN THERMAL PAD POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 768 PROCESS: Si Gate BiCMOS FIGURE 18. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE 13 FN6587.1 February 18, 2008 ISL3259E Small Outline Plastic Packages (SOIC) N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45 H 0.25(0.010) M BM M8.15 (JEDEC MS-012-AA ISSUE C) 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 L MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 5.80 0.25 0.40 8 8 0 8 MAX 1.75 0.25 0.51 0.25 5.00 4.00 6.20 0.50 1.27 NOTES 9 3 4 5 6 7 Rev. 1 6/05 MIN 0.0532 0.0040 0.013 0.0075 0.1890 0.1497 0.2284 0.0099 0.016 8 0 MAX 0.0688 0.0098 0.020 0.0098 0.1968 0.1574 0.2440 0.0196 0.050 B C D E e H C A1 0.10(0.004) 0.050 BSC 1.27 BSC e B 0.25(0.010) M C AM BS h L N NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 14 FN6587.1 February 18, 2008 ISL3259E Mini Small Outline Plastic Packages (MSOP) N M8.118 (JEDEC MO-187AA) 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE E1 E INCHES SYMBOL MIN 0.037 0.002 0.030 0.010 0.004 0.116 0.116 0.187 0.016 MAX 0.043 0.006 0.037 0.014 0.008 0.120 0.120 0.199 0.028 MILLIMETERS MIN 0.94 0.05 0.75 0.25 0.09 2.95 2.95 4.75 0.40 MAX 1.10 0.15 0.95 0.36 0.20 3.05 3.05 5.05 0.70 NOTES 9 3 4 6 7 15o 6o Rev. 2 01/03 INDEX AREA -B12 TOP VIEW 0.25 (0.010) GAUGE PLANE SEATING PLANE -C4X R1 R 0.20 (0.008) ABC A A1 A2 b c D E1 4X L L1 e E L 0.026 BSC 0.65 BSC A A2 A1 -He D b 0.10 (0.004) -A0.20 (0.008) C SEATING PLANE L1 N R 0.037 REF 8 0.003 0.003 5o 0o 15o 6o 0.95 REF 8 0.07 0.07 5o 0o C a C L E1 C R1 0 SIDE VIEW -B- 0.20 (0.008) CD END VIEW NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension "D" does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E1" does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (0.004) at seating Plane. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of "b" dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A -H- . and - B - to be determined at Datum plane 11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only. 15 FN6587.1 February 18, 2008 ISL3259E Dual Flat No-Lead Plastic Package (DFN) 2X 0.10 C A A D 2X 0.10 C B L10.3x3C 10 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS SYMBOL A E MIN 0.85 - NOMINAL 0.90 0.20 REF MAX 0.95 0.05 NOTES - A1 A3 b D 6 INDEX AREA TOP VIEW B 0.20 0.25 3.00 BSC 0.30 5, 8 - D2 // 0.10 C 0.08 C 2.33 2.38 3.00 BSC 2.43 7, 8 - E E2 e k L 0.20 0.35 1.59 A C SEATING PLANE SIDE VIEW A3 1.64 0.50 BSC 0.40 10 5 1.69 7, 8 - 0.45 8 2 3 Rev. 1 4/06 D2 (DATUM B) 1 2 D2/2 7 8 N Nd NOTES: NX k E2 6 INDEX AREA (DATUM A) 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd refers to the number of terminals on D. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. E2/2 NX L N 8 N-1 NX b e (Nd-1)Xe REF. BOTTOM VIEW C L NX (b) 5 SECTION "C-C" CC e TERMINAL TIP (A1) 9L 5 0.10 M C A B 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. 9. COMPLIANT TO JEDEC MO-229-WEED-3 except for dimensions E2 & D2. FOR ODD TERMINAL/SIDE All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 16 FN6587.1 February 18, 2008 |
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